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Development of Measurement System of Contact Pressure Distribution for Evaluation of Cup
Stability of Artificial Hip Joint [Abstracts of the 39th Annual Meeting
of the Japanese Society for Clinical Biomechanics, Chiba/Makuhari Messe
International Conference Hall, (2012-11/9-10), 94]
S. Tsukahara, K. Sasagawa and T. Nishii
Numerical Modeling of Electromigration Damage in Multilevel Interconnection
with Reservoir Structure for Evaluation of Allowable Electric Current [Proceedings
of the 7th International Symposium on Advanced Science and Technology in
Experimental Mechanics, Taipei/The Grand Hotel, Taiwan, (2012-11/8-11),
G101]
K. Sasagawa, T. Yanagi and J. Unuma
Development of Shear Stress Sensing System for Application to a Haptic
Display [Proceedings of the 7th International Symposium on Advanced Science
and Technology in Experimental Mechanics, Taipei/The Grand Hotel, Taiwan,
(2012-11/8-11), M117]
K. Sasagawa, T. Oyama, K. Tokiyoshi and K. Yokoyama
Development of Thin and Flexible Sensor System for Contact Pressure and
Shear Stress [Proceedings of the 23rd JSME Conference on Frontiers in Bioengineering,
Hirosaki/Hirosaki Cultural Center, Japan, (2012-10/5-6), 27-28]
T. Oyama, K. Tokiyoshi and K. Sasagawa
Measurement System for Contact Pressure between Tongue and Plate in Swallowing
[Proceedings of the 23rd JSME Conference on Frontiers in Bioengineering,
Hirosaki/Hirosaki Cultural Center, Japan, (2012-10/5-6), 23-24]
S. Tsukahara, K. Sasagawa, M. Sugisaki and I. Takakura
Evaluation of Threshold Current Density in Interconnect with Reservoir
Structure Using Numerical Modeling of Electromigration Damage [Extended
Abstracts of the 2012 International Conference on Solid State Devices and
Materials, Kyoto/Kyoto International Conference Center, Japan, (2012-9/25-27),
56-57]
K. Sasagawa and T. Yanagi
Evaluation of Threshold Current Density of Electromigration Damage in Via-connected
Lines with Reservoir Structure by Numerical Simulation [Proceedings of the 22nd Microelectronics Symposium, Fall Meeting of the Japan Institute of Electronics Packaging,Osaka/Osaka Prefecture University, Japan, (2012-9/12-13), 191-194]
K. Sasagawa, T. Yanagi and J. Unuma
A Comparison of Electromigration Falure of Metal Line with Fracture Mechanics
[Acta Mech. Sin. 28(3), (2012-8), 774-781]
H. Abè, M. Muraoka, K. Sasagawa and M. Saka
Development of Numerical Simulation of Electromigration Damage in Cu Multilevel
Interconnection with Reservoir Structure [Abstracts of the 12th International
Workshop on Stress-Induced Phenomena in Microelectronics, Kyoto/Co-op Inn
Kyoto, Japan, (2012-5/28-30), 31-32]
K. Sasagawa and T. Yanagi