2003 academic year

Electromigration [Journal of the Japanese Society for Experimental Mechanics, 3(4), (2003-12), 71-72]
K. Sasagawa



Derivation of the Film Characteristic Constants Using the Governing Parameter for Electromigration Damage at Metal Line Ends [Proc. of ISMME2003, The International Symposium on Micro-Mechanical Engineering-Heat Transfer, Fluid Dynamics, Reliability and Mechatronics, JSME, Tsuchiura, Japan, (2003-12/1), 433-439]
M. Hasegawa, K. Sasagawa, S. Uno and M. Saka



Derivation of the Film Characteristic Constants Based on Drift Velocity Measurement [Proc. the Second Tohoku Division Conference, Hirosaki/Hirosaki University, (2003-11/15), 10-11]
M. Hasegawa, K. Sasagawa, S. Uno and M. Saka



Film Characteristics Derived by the Governing Parameter for Electromigration Damage at Metal Line End [Proc. the 16th Computational Mechanics Conference, No.03-02, Kobe/Kobe University, (2003-11/22~24), 665-666]
M. Hasegawa, K. Sasagawa, Y. Watanabe, S. Uno and M. Saka



Failure Prediction of the Metal Line in IC Considering Passivation Thickness [Proc. The 11th Symposium on Fracture and Fracture Mechanics, Otu/KKR Hotel Biwako, (2003-10/2~3), 127-132]
K. Sasagawa, M. Hasegawa, N. Yoshida and M. Saka



Measurement of Modulus of Elasticity of Porcine Meniscus [Proc. 2003 Annual Meeting of the JSME/MMD, No.03-11, Toyama/Toyama University, (2003-9/24~26), 639-640]
K. Sasagawa, Y. Yoshida, S. Abo, H. Miyata, Y. Ishibashi and S. Suto



Failure Prediction in Passivated Polycrystalline Line Considering Passivation Thickness [Proc. 2003 Annual Meeting of the JSME/MMD, No.03-11, Toyama/Toyama University, (2003-9/24~26), 609-610]
K. Sasagawa, M. Hasegawa and M. Saka



A Governing Parameter of Electromigration Damage on Line Ends [Proc. Mechanical Engineering Congress Japan 03 (VI), No.03-1, Tokushima/The University of Tokushima, (2003-8/5~8), 239-240]
M. Hasegawa, K. Sasagawa and M. Saka



Prediction of Electromigration Failure in Passivated Polycrystalline Line Considering Passivation Thickness [Proc. of InterPACK '03(CD-ROM), The Pacific Rim/ASME International Electronic Packaging Technical Conference & Exhibition, ASME, Maui, Hawaii, USA, (2003-7/6~11), InterPack 2003-35065]
K. Sasagawa, M. Hasegawa, N. Yoshida, M. Saka and H. Abe



Expression of a Governing Parameter for Electromigration Damage on Metal Line Ends [Proc. of InterPACK '03(CD-ROM), The Pacific Rim/ASME International Electronic Packaging Technical Conference & Exhibition, ASME, Maui, Hawaii, USA, (2003-7/6~11), InterPack 2003-35064]
M. Hasegawa, K. Sasagawa, M. Saka and H. Abe