弘前大学　理工学部　知能機械工学科　機械材料機能学分野

2001年度学術論文

Governing Parameter for Electromigration Damage in the Polycrystalline Line Covered with Passivation Layer [Journal of Applied Physics, 91(4), (2002-2/15), 1882-1890]
K. Sasagawa, M. Hasegawa, M. Saka and H. Abé



エレクトロマイグレーション損傷の支配パラメータを用いた表面に保護膜を有する多結晶配線の断線予測とその検証　[日本機械学会　第14回計算力学講演会　講演論文集, No.01-10, (2001-11), 483-484]
笹川和彦, 長谷川昌孝, 坂 真澄, 阿部博之

Prediction of Electromigration Failure in Passivated Polycrystalline Line by Using Governing Parameter of Electromigration Damage [Proc. the 14th Computational Mechanics Conference, (2001-11), 483-484]
K. Sasagawa, M. Hasegawa, M. Saka and H. Abé

Effects of Corner Position and Operating Condition on Electromigration Failure in Angled Bamboo Lines without Passivation Layer [Thin Solid Films, 401(1-2), (2001-12/17), 255-266]
K. Sasagawa, M. Hasegawa, K. Naito, M. Saka and H. Abé



A Governing Parameter for Electromigration Damage in Passivated Polycrystalline Lines and Its Verification [Stress-Induced Phenomena in Metallization: Proc. Sixth International Workshop, edited by S.P. Baker et al, AIP, Cornell University, Ithaka, USA, July 25~27, 2001, (2002), 74-85]
K. Sasagawa, M. Hasegawa, M. Saka and H. Abé



表面に保護膜を有する多結晶配線のエレクトロマイグレーション損傷支配パラメータの実験的検証　[日本機械学会　平成13年度材料力学部門講演会　講演論文集, No.01-16, (2001-8), 537-538]
笹川和彦, 長谷川昌孝, 坂 真澄, 阿部博之

Verification of the Governing Parameter for Electromigration Damage in Polycrystalline Line with Passivation Layer [Proc. the 2001 Annual Meeting of JSME/MMD, (2001-8), 537-538]
K. Sasagawa, M. Hasegawa, M. Saka and H. Abé

表面に保護膜を有する多結晶配線のエレクトロマイグレーション損傷支配パラメータとその実験的検証　 [応用物理学会　LSI配線における原子輸送・応力問題第7回研究会予稿集, (2001-7), 17-18]
笹川和彦, 長谷川昌孝, 坂真澄, 阿部博之

A Governing Parameter for Electromigration Damage in Passivated Polycrystalline Line and Its Verification [Proc. 7th Conf. Atomic Transportation and Stress Problem in LSI Metallization, (2001-7), 17-18]
K. Sasagawa, M. Hasegawa, M. Saka and H. Abé

Verification of the Governing Parameter for Electromigration Damage in Passivated Polycrystalline Line [Proc. of InterPACK '01(CD-ROM), The Pacific Rim/International, Intersociety, Electronic Packaging Technical/Business Conference & Exhibition, ASME, Kauai, Hawaii, USA, July 8~13, 2001, (2001-7/9), IPACK2001-15644, 1-9]
K. Sasagawa, M. Hasegawa, M. Saka and H. Abé



A Governing Parameter for Electromigration Damage and Prediction of Failure in Al Lines [Proc. of Int. Symposia on Material Science for the 21st Century, Osaka, Japan, (2001-5/21), 245-248]
K. Sasagawa, K. Naito, M. Hasegawa, M. Saka and H. Abé