Ⅰ．学術論文(査読付きFull Paper)
1.
感圧導伝ゴムを応用した側弯症装具矯正効果判定の試み，整形外科バイオメカニクス，12 (1990)，215-217，新井久夫・古賀良生・高橋一雄・原利昭・笹川和彦・中部昇・茂野勇一
2.
膝蓋大腿関節の接触圧力分布－膝関節運動及び脛骨結節浮上術に関連して－，整形外科バイオメカニクス，12 (1990)，225-228，笹川和彦・中部昇・原利昭・古賀良生・大森豪
3.
人工膝関節置換後の膝蓋骨脱臼についての検討，整形外科バイオメカニクス，12 (1990)，255-258，中部昇・笹川和彦・原利昭・古賀良生・大森豪
4.
人工膝関節置換術後の膝蓋大腿関節におけるpatella
trackingと接触圧力についての実験的検討，整形外科バイオメカニクス，13 (1991)，387-391，大森 豪・古賀良生・高橋栄明・笹川和彦・原利昭・Joan E.
Bechtold・Ramon B. Gustilo
5.
ＰＴＢ下腿装具の免荷性の評価，日本機械学会論文集（Ａ編），58 (1992)，1148-1153，笹川和彦・原利昭・石井卓・古賀良生・金谷喜久雄・田村義則
6.
感圧導電ゴムを用いた関節内接触圧力分布測定システム，日本機械学会論文集（Ａ編），58 (1992)，1154-1159，原利昭・笹川和彦・中部昇・古賀良生・金谷喜久雄
7.
股関節接触面圧の実験的解析－感圧導電ゴムセンサーを使用して－，日本臨床バイオメカニクス学会，14 (1992)，315-318，元田英一・三浦隆行・岩崎洋史・笹川和彦・
8.
膝蓋大腿関節の接触圧力分布および膝蓋骨trackingの同時測定システム，日本臨床バイオメカニクス学会，14 (1992)，319-323，今井和実・笹川和彦・原利昭・大森豪・高橋美徳・古賀良生
9.
膝蓋骨非置換人工膝関節置換術後の膝蓋大腿関節における接触動態についての実験的検討，日本臨床バイオメカニクス学会，14 (1992)，325-329，大森豪・古賀良生・笹川和彦・原利昭・今井和実・Joan E.
Bechtold・Ramon Gustilo
10. 脛骨結節前方移行術前後の膝蓋大腿関節の接触圧力および膝蓋骨trackingの変化，日本臨床バイオメカニクス学会，14 (1992)，331-334，笹川和彦・今井和実・原利昭・大森豪・高橋美徳・古賀良生
11. 下肢アライメント変化による膝関節接触圧力への影響についての実験的検討，日本臨床バイオメカニクス学会，14 (1992)，341-344，岩崎洋史・笹川和彦・原利昭・大森 豪・高橋美徳・古賀良生
12. 駆血帯装着時の接触圧力分布測定，日本臨床バイオメカニクス学会，14 (1992)，453-456，船平伸之・笹川和彦・原利昭・佐藤朗・古賀良生
13. 膝蓋骨非置換ＴＫＡにおける膝蓋大腿関節の適合性についての検討，日本臨床バイオメカニクス学会誌，15 (1994)，483-488，中部昇・今井和実・原利昭・笹川和彦・大森豪・古賀良生
14. THEORETICAL
ANALYSIS OF ELECTROTHERMAL CRACK PROBLEM CONSIDERING THOMSON EFFECT, Mechanics
and Materials for Electronic Packaging: Volume 3 - Coupled Field Behavior in
Materials, 1994 International Mechanical Engineering Congress and Exposition,
THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS, AMD-193 (1994)，53-59, Masumi Saka, Kazuhiko Sasagawa, and Hiroyuki Abé
15. CURRENT DENSITY
AND TEMPERATURE DISTRIBUTIONS NEAR THE CORNER OF ANGLED METAL LINE, Mechanics
Research Communications, 22(5) (1995), 473-483, K. Sasagawa, M. Saka and
H. Abé
16. THEORETICAL
ANALYSIS OF A CRACK PROBLEM IN ELECTROTHERMAL FIELD, Application of Fracture
Mechanics in Electronic Packaging and Materials, THE 1995 ASME INTERNATIONAL
MECHANICAL ENGINEERING CONGRESS AND EXPOSITION，THE AMERICAN
SOCIETY OF MECHANICAL ENGINEERS, EEP-11/MD-64 (1995), 1-6, Kazuhiko
Sasagawa, Masumi Saka and Hiroyuki Abé
17. Analysis of
Electromigration in Angled Metal Line, Experimental/Numerical Mechanics in
Electronic Packaging, SEM, 1 (1996), 108-116, K. Sasagawa, Y. Honma, M.
Saka and H. Abé
18. Contact
pressure and three-dimensional tracking of unresurfaced patella in total knee
arthroplasty, The Knee, 4 (1997), 15-21, Go Omori, Yoshio Koga, Joan E.
Bechtold, Ramon B. Gustilo, Noboru Nakabe, Kazuhiko Sasagawa, Toshiaki Hara,
Hideaki E. Takahashi
19. EFFECT OF
ROUNDNESS GIVEN TO CORNER OF ANGLED METAL LINE ON ELECTROMIGRATION FAILURE,
Advances in Electronic Packaging, PROCEEDINGS OF THE PACIFIC RIM/ ASME
INTERNATIONAL INTERSOCIETY ELECTRONIC & PHOTONIC PACKAGING CONFERENCE
INTERPACK ’97, THE AMERICAN SOCIETY
OF MECHANICAL ENGINEERS, EEP-19-1 (1997), 1177-1182, Kazuhiko Sasagawa,
Naoaki Nakamura, Masumi Saka and Hiroyuki Abé
20. Study on
Electromigration Considering Singularity of Temperature Gradient at Corner,
Experimental/Numerical Mechanics in Electronic Packaging, SEM, 2 (1997),
126-133, Kazuhiko Sasagawa, Naoaki Nakamura, Masumi Saka and Hiroyuki Abé
21. Analysis of
Electromigration Considering Thomson Effect, Thermo-Mechanical Characterization
of Evolving Packaging Materials and Structures, THE 1998 ASME INTERNATIONAL
MECHANICAL ENGINEERING CONGRESS AND EXPOSITION，THE AMERICAN
SOCIETY OF MECHANICAL ENGINEERS, EEP-24 (1998), 87-92, K. Sasagawa, M.
Yagi, M. Saka and H. Abé
22. A New Approach to Calculate
Atomic Flux Divergence by Electromigration, Transactions of the ASME, Journal
of Electronic Packaging, 120(1998), 360-366, K. Sasagawa N. Nakamura M. Saka H. Abé
23. 金属薄膜配線におけるエレクトロマイグレーション損傷支配パラメータの実験的検証，日本機械学会論文集(Ａ編)，65 (631), (1999-3),
469-476，笹川和彦, 中村直章, 坂真澄, 阿部博之
24. Verification of
a Governing Parameter for Electromigration Damage in Bamboo Lines, Advances in
Electronic Packaging, PROCEEDINGS OF THE PACIFIC RIM/ ASME INTERNATIONAL
INTERSOCIETY ELECTRONIC & PHOTONIC PACKAGING CONFERENCE INTERPACK ’99, THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS, EEP-16-1
(1999), 227-232, Kazuhiko Sasagawa, Kazushi Naito, Masataka Hasegawa, Masumi
Saka and Hiroyuki Abé
25. Prediction of
Electromigration Failure in Bamboo Lines, Advances in Electronic Packaging,
PROCEEDINGS OF THE PACIFIC RIM/ ASME INTERNATIONAL INTERSOCIETY ELECTRONIC
& PHOTONIC PACKAGING CONFERENCE INTERPACK ’99, THE
AMERICAN SOCIETY OF MECHANICAL ENGINEERS, EEP-16-1 (1999), 233 - 238,
Kazuhiko Sasagawa, Kazushi Naito, Masumi Saka and Hiroyuki Abé
26. A Method to
Predict Electromigration Failure of Metal Lines [Journal of Applied Physics, 86
(11), (1999-12), 6043 - 6051] K. Sasagawa, K. Naito, M. Saka and H. Abé
27. Atomic Flux
Divergence in Bamboo Line for Predicting Initial Formation of Voids and
Hillocks [Theoretical and Applied Fracture Mechanics, 33 (1), (2000-2),
67 - 72] K. Sasagawa, M. Hasegawa, M. Saka and H. Abé
28. Experimental Verification
of Prediction Method for Electromigration Failure of Polycrystalline Lines
[Journal of Applied Physics, 87 (6), (2000-3-15), 2785 - 2791] K.
Sasagawa, K. Naito, H. Kimura, M. Saka and H. Abé
29. Verification of
the Governing Parameter for Electromigration Damage in Passivated
Polycrystalline Line [Proc. of InterPACK '01, The Pacific Rim/International, Intersociety,
Electronic Packaging Technical/Business Conference & Exhibition, ASME,
Kauai, Hawaii, USA, July 8-13, 2001, (2001-7-9), IPACK2001-15644, 1-9] K.
Sasagawa, M. Hasegawa, M. Saka and H. Abé
30. Effects of
Corner Position and Operating Condition on Electromigration Failure in Angled
Bamboo Lines without Passivation Layer [Thin Solid Films, 401(1-2),
(2001-12-17), 255 - 266] K. Sasagawa, M. Hasegawa, K. Naito, M. Saka and H. Abé
31. Governing
Parameter for Electromigration Damage in the Polycrystalline Line Covered with
Passivation Layer [Journal of Applied Physics, 91(4), (2002-2-15),
1882-1890] K. Sasagawa, M. Hasegawa, M. Saka and H. Abé
32. Prediction of
Electromigration Failure in Passivated Polycrystalline Line [Journal of Applied
Physics,
91(11), (2002-6-1), 9005-9014] K. Sasagawa, M. Hasegawa,
M. Saka and H. Abé
33. Simulation of
Electromigration Failure in Angled Polycrystalline Line Covered with Passivation
Layer [Advances in Computational Engineering & Sciences, Proc. 2002
International Conference for Computational Engineering and Sciences(CD-ROM),
(2002-7/31-8/2, Reno), paper-ID 86] M. Hasegawa, K. Sasagawa, M.
Saka and H. Abé
34. Derivation of
Film Characteristics and Prediction of Electromigration Failure in Passivated
Polycrystalline Line [Advanced Metallization Conference 2002, (2002-10/28-30),
MRS, 291-296] K. Sasagawa, M. Hasegawa, M. Saka and H. Abé
35. Failure
Simulation of Angled Polycrystalline Lines Covered with Passivation Layer
[Proc. 2002 ASME International Mechanical Engineering Congress & Exposition
(CD-ROM), ASME, Nov. 17-22, 2002, New Orleans, USA, paper-ID IMECE2002-39677] M. Hasegawa, K. Sasagawa, M.
Saka and H. Abé
36. Expression of a
Governing Parameter for Electromigration Damage on Metal Line Ends [Proc. of
InterPACK '03(CD-ROM), The Pacific Rim/ASME International Electronic Packaging
Technical Conference & Exhibition, ASME, Maui, Hawaii, USA, July 6-11,
2003, (2003-7-6), InterPack2003-35064] M. Hasegawa, K. Sasagawa, M. Saka and H.
Abé
37. Prediction of
Electromigration Failure in Passivated Polycrystalline Line Considering
Passivation Thickness [Proc. of InterPACK '03(CD-ROM), The Pacific
Rim/ASME International Electronic Packaging Technical Conference &
Exhibition, ASME, Maui, Hawaii, USA, July 6-11, 2003, (2003-7-6),
InterPack2003-35065] K. Sasagawa, M. Hasegawa, N. Yoshida, M. Saka and H. Abé
38. Derivation of
Film Characteristic Constants by Using Governing Parameter for Electromigration
Damage in Passivated Bamboo Line [Proceedings of 11th International Conference
on Fracture (CD-ROM), March 20-25, 2005, Turin, Italy, Paper ID 3699] M.
Hasegawa, K. Sasagawa and M. Saka
39. Effect of
Line-Shape on Threshold Current Density of Electromigration Damage in Bamboo
Lines [Proceedings of IPACK2005(CD-ROM), The ASME/Pacific Rim Technical
Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and
Electronic Systems, ASME, July 17-22, 2005, San Francisco, California, USA,
Paper ID IPACK2005-73133] K. Sasagawa, S. Uno, N. Yamaji and M. Saka
40. Verification of
Prediction Method for Electromigration Failure Using Angled Polycrystalline
Line [Key Engineering Materials, Vol. 297-300(Advances in Fracture and
Strength), Proc. Asian Pacific Conference for Fracture and Strength ’04, Lotte
Hotel Jeju, Korea (2004-10/6-8), Nov. 2005, 263-268] S. Uno, M.
Hasegawa, K. Sasagawa and M. Saka
41. Electromigration
Failure of Metal Lines [International Journal of Fracture, Volume 138, Numbers
1-4, March 2006, 219-240] H. Abé, K.
42. Evaluation of
Threshold Current Density of Electromigration Damage in Angled Bamboo Lines
[Proceedings of ASME 2007 InterPACK Conference(CD-ROM), The ASME/Pacific Rim
Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS,
and Electronic Systems, ASME, July 8-12, 2007, Vancouver, British Columbia,
CANADA, Paper ID IPACK2007-33237] K.
43. 高位脛骨骨切り術前後における膝蓋大腿関節の接触圧力分布測定 [日本臨床バイオメカニクス学会誌, Vol.28 (2007/11/20), 173-177] 成田純平，笹川和彦，塚田晴彦，石橋恭之
44. リンパ浮腫治療用弾性ストッキングと下肢間の接触圧力分布測定システム[日本臨床バイオメカニクス学会誌, Vol.28 (2007/11/20), 433-437] 矢島久幸，笹川和彦，細川賀乃子，近藤和泉
45. Threshold
Current Density of Electromigration Damage in Angled Polycrystalline Line [Key
Engineering Materials Vols. 353-358 (2007, Nov.) pp. 2958-2961] K.
46. Formation of
Metallic Micro/Nanomaterials by Utilizing Migration Phenomena and Techniques
for Their Applications [Materials Science Forum, Vol. 614, (Mar., 2009),
3-9] M. Saka, H. Tohmyoh, M. Muraoka, Y. Ju, and K. Sasagawa
47. Derivation of
Electromigration Characteristic Constants of Metal Line Used in Electronic
Devices [Proc. 12th Int. Conf. Fracture, July 12-17, 2009, Ottawa, Canada
(CD-ROM), (July, 2009), Paper No. T22.009. (total 9 pages)] K. Sasagawa, T.
Gomyo, and A. Kirita
48. Numerical
Simulation of Threshold Current Density of Electromigration Damage in Cu
Interconnect Tree [Proc. ASME 2009 InterPACK Conf., July 19-23, 2009, San
Francisco, California, USA (CD-ROM), (2009), Paper No. IPACK2009-89229 (total 6
pages)] K. Sasagawa, A. Kirita, T. Abo, and A.H. Hassan
49. 嚥下時の口腔および咽頭内の接触圧力同時測定システムの開発, 臨床バイオメカニクス, Vol.30, （２００９年９月２０日），83-87] 大里泰彦，笹川和彦，横山紘太郎，才藤栄一，近藤和泉
50. ステント形状評価を目的とした血管―ステント間の接触圧力分布測定システム, 臨床バイオメカニクス, Vol.30, （２００９年９月２０日），249-253] 笹川和彦，横山紘太郎，成田純平
51. Derivation of
Film Characteristic Constants of Polycrystalline Line for Reliability
Evaluation against Electromigration Failure [Mechanics of Materials, 41(10)
, (Oct., 2009), 1090-1095] M. Hasegawa, K. Sasagawa, S. Uno, M. Saka and H. Abé
52. A Numerical
Simulation of Nanostructure Formation Utilizing Electromigration [J. Electron.
Mater., 38(10), (Nov., 2009), 2201-2206] K. Sasagawa, S. Fukushi, Y.
Sun, and M. Saka
53. Simulation of
Nanostructure Production by Electromigration Considering Specimen's Shape [J.
Nanosci. Nanotechnol., 10(9), (2010-9), 6036-6040] K. Sasagawa, A.
Kirita, S. Fukushi and M. Saka
54. Development of
Sensor System for Measurement of Distributions of Contact Pressure and Shear
Stress on Contacting Skin Surface [The 5th International Symposium on Advance
and Technology in Experimental Mechanics(CD-ROM), Kyoto/Ryukoku University,
(2010-11/4~7), Paper ID: 127] K. Sasagawa, K. Tokiyoshi
55. Development of
Simulation of Nanostructure Production due to Electromigration Considering
Specimen’s Damage [Proc. the 4th JSME/ASME International Conference on
Materials and Processing(CD-ROM), Corvallis, Oregon, USA, (2011-6/13~17), Papar
ID: ICMP2011-51113] K.Sasagawa, T. Abo and J. Unuma
56. Effect of
Oxygen Concentration on Damage Mechanism of Carbon Nanotubes under High Current
Density [Proc. ASME 2011 InterPACK Conf.(CD-ROM), Portland, Oregon, USA,
(2011-7/6~8), Paper ID: InterPACK2011-52169] K.Sasagawa, J. Unuma and T. Abo
57. 内視鏡手術への応用を目的とした高空間分解能接触圧力センサシステムの開発 [臨床バイオメカニクス, Vol.32, (2011-10/25), 185-190] 笹川和彦, 石川諒, 横山紘太郎, 大里泰彦
58. 生体への適用を目的とした接触圧力およびせん断応力の同時測定センサの開発 [臨床バイオメカニクス, Vol.32, (2011-10/25), 309-313] 時吉康太, 笹川和彦
59. A Comparison of
Electromigration Failure of Metal Lines with Fracture Mechanics [Acta Mech.
Sin. 28(3), (2012-8):774–781] H. Abé, M. Muraoka, K. Sasagawa and M.
Saka
60. Numerical
Modeling of Electromigration Damage in Multilevel Interconnection with
Reservoir Structure for Evaluation of Allowable Electric Current [Proceedings
of the 7th International Symposium on Advanced Science and Technology in
Experimental Mechanics, Taipei/The Grand Hotel, Taiwan, (2012-11/8-11), Paper
ID: G101] K. Sasagawa, T. Yanagi and J. Unuma
61. Numerical Study
of Allowable Current Density for Electromigration Damage of Multilevel
Interconnection in Integrated Circuit [Proceedings of 13th International
Conference on Fracture (CD-ROM), Paper ID: S30-008, 8 pages, (2013/6/19, China
National Convention Center, Beijing, China)] K. Sasagawa, K. Fujisaki, T.
Yanagi
62. Novel motion
preservation device for atlantoaxial instability [J. Spinal Disorders &
Techniques, 26(3), (May 2013), pp. E107-111] Kato, Kozo; Yokoyama, Toru;
Ono, Atsushi; Numasawa, Takuya; Wada, Kanichiro; Tonosaki, Yoshikazu; Osato,
Yasuhiko; Sasagawa, Kazuhiko; Toh, Satoshi
63. Development of
Contact-Pressure and Shear-Stress Sensing System for Application to a Haptic
Display [J. JSEM, Vol.13, (July 2013), pp. s228-s232, 2013] K. Sasagawa,
T. Oyama, K. Tokiyoshi, K. Yokoyama
64. 人工股関節置換術におけるカップ固定性評価を目指した接触圧力分布測定システムの開発 [臨床バイオメカニクス, Vol.34, (Nov. 2013), pp.129-134] 塚原 智, 笹川和彦, 西井 孝
65. Experimental
Study of Damage Mechanism of Carbon
Nanotube as Nanocomponent of Electronic Devices under High Current Density
[ASME J. Electronic Packaging, Vol. 136, No. 4,Dec. 2014, 041011-1-5] K.
Sasagawa, K. Fujisaki, J. Unuma, R. Azuma
66. ラットアキレス腱の引張試験による弾性率評価 [臨床バイオメカニクス, Vol. 35, pp. 303-307, (2014)] 小山拓馬, 藤崎和弘, 笹川和彦, 飯尾浩平, 津田英一, 山本祐司, 石橋恭之
67. Numerical
Analysis of Allowable Current Density for Electromigration of Interconnect Tree
Structure with Reservoir [Proceedings of ASME InterPACKICNMM2015, Paper No.
IPACK2015-48744, V002T02A015; 5
pages，doi:10.1115/IPACK2015-48744，20150706-9, San Francisco, USA] K. Fujisaki, H. Narita, K.
Sasagawa
68. Evaluation of
(Bi0.4Sr0.6)xCo0.3Fe0.7O3−δ
(x = 0.7, 0.8, 0.9, 1.0, 1.1) perovskite-type oxide as potential cathode for
intermediate-temperature solid oxide fuel cells [International Journal of
Hydrogen Energy, Volume 40, Issue 34, 14 September 2015, Pages 11011–11021,
doi:10.1016/j.ijhydene.2015.05.195] Deni S. Khaerudini, Guoqing Guan, Peng
Zhanga, Xiaogang Hao, Zhongde Wang, Yutaka Kasai, Kazuhiko Sasagawa, Abuliti
Abudula
69. Development of
Thin and Flexible Sensor System for Stress Evaluation of Contact Interface［2016 Design of Medical Devices Conference, Minneapolis,
Minnesota, 20160413, ASME Journal of Medical Devices, 2pages］K. Fujisaki, S. Ogawa, R. Kasai, K. Sasagawa
70. Damage of
Single-Wall Carbon Nanotube Network Structure under Electric Current Loading
[JSME Mechanical Engineering Journal, Vol. 3 (2016), No. 3, Paper NO. 16-00292
(8 pages)] Syunsuke SATO, Kazuhiro FUJISAKI, Kazuhiko SASAGAWA
71. Development of
Thin and Flexible Contact Pressure Sensing System for High Spatial Resolution
Measurements [Sensors and Actuators A: Physical, 20170815, Vol.263, pp.610-613]
Kazuhiko Sasagawa, Junpei Narita
72. Relationship between
Threshold Current Density of Electromigration Damage Considering Void and
73. Hillock Formation and Reservoir Shape in
Interconnect Line [ InterPACK 2017(ASME),San Francisco, USA, 20170830,
Proceedings of InterPACK 2017, Paper No. IPACK2017-74092 ] Ryuji Takaya,
Kazuhiko Sasagawa, Kazuhiro Fujisaki, Takeshi Moriwaki
74. Analysis for
Evaluation of Threshold Current Density of Electromigration Damage in
Taper-shaped
75. Metal Line [ InterPACK 2017(ASME),San
Francisco, USA, 20170830, Proceedings of InterPACK 2017, Paper No.
IPACK2017-74509] Hiroki Kikuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki
76. 採血手技の運動および力覚の計測 [臨床バイオメカニクス、20171002、Vol.38(2017)、pp.393-398]其田雅人、笹川和彦、藤崎和弘、森脇健司、萱場広之
77. Effect of
Voltage-induced Apatite Deposition Process on Mechanical Properties of
Demineralized Bone Tissue [ The 12th International Symposium in Advanced
Science and Technology in Experimental Mechanics (ISEM), Kanazawa, Japan,
20171104, Proceedings of ISEM2017, Paper No.084] Naoya Saito, Kazuhiro
Fujisaki, Takeshi Moriwaki, Kazuhiko Sasagawa
78. Development of
Tube-type Pressure Distribution Sensor for Performance Evaluation of
Endovascular Device [ The 12th International Symposium in Advanced Science and
Technology in Experimental Mechanics (ISEM), Kanazawa, Japan, 20171104,
Proceedings of ISEM2017, Paper No.085] Takeshi Moriwaki, Asuka Saito, Kazuhiko
Sasagawa, Kazuhiro Fujisaki
79. Evaluation of
Mechanical Properties of Microscopic Structure of Aortic Tissue by Means of
Peeling Tests [ The 12th International Symposium in Advanced Science and
Technology in Experimental Mechanics (ISEM), Kanazawa, Japan, 20171104,
Proceedings of ISEM2017, Paper No.090] Shohei Nakargawa, Kazuhiro Fujisaki,
Takeshi Moriwaki, Kazuhiko Sasagawa
80. Development of
Contact Pressure and Shear Stresses Sensor for Touch Panel [JSME Mechanical
Engineering Letters, 4(2018), Paper No.18-00257[DOI: 10.1299/mel.18-00257]] R.
Kasai, K. Sasagawa, K. Fujisaki, S. Saito, H. Koyama
Ⅱ．著書
1.
機械工学便覧 [基礎編α３材料力学(2005-4-25)，分担執筆１３・１４，199 – 200，日本機械学会，丸善] 笹川和彦ほか （全８６名）
2.
よくわかる実験技術・学術用語 [(2006-11-1)，分担執筆 よくわかる学術用語 エレクトロマイグレーション，ISBN4-9903400-0-0, 91 – 92，横山 隆，松井剛一，井口 学編集，日本実験力学会，全123頁] 笹川和彦ほか （全３５名）
3.
金属微細配線におけるマイグレーションのメカニズムと対策 [(2006-12-25)，分担執筆 第１２章エレクトロマイグレーションの損傷予測モデリング，ISBN4-903413-15-2, 151 –
174，新宮原 正三 監修，サイエンス＆テクノロジー，全206頁] 笹川和彦ほか （全１５名）
4.
Metallic Micro and Nano Materials - Fabrication with Atomic
Diffusion [Engineering Materials, M. Saka (Ed.), Springer, (2011) ,
ISBN978-3-642-15410-2] M. Saka, K. Sasagawa, M. Muraoka, H. Tohmyoh and Y. Ju
(Authors),
Ⅲ．解説記事
1.
圧力センサーを使用した側弯矯正装具のチェックシステム，日本義肢装具学会誌，8 (1992), 35-37，田村義則・赤川喜一・古賀良生・新井久夫・高橋一雄・原利昭・笹川和彦・中部昇
2.
感圧導電ゴムセンサとその応用－下腿装具の機能評価－，センサ技術，12 (1992)，62-67，原利昭・笹川和彦・古賀良生
3.
ＬＳＩ断線シミュレーション 弘前大がソフト開発，日刊工業新聞，5月21日(1999)，7
4.
Software for Simulation of Line Failure of LSI Devices，New Technology Japan，JETRO，27(6)，1999-9，33
5.
半導体の損傷予測ソフト開発，東奥日報，11月20日(2001)，16
6.
エレクトロマイグレーション，日本実験力学会誌「実験力学」,3(4),
(2003-12)，71-72，笹川和彦
7.
米機械学会で最優秀 半導体の損傷・寿命を予測，東奥日報，9月20日(2007)，夕刊3
8.
生体に作用する応力計測, 非破壊検査, Vol.62, pp. 515-521, 2013.10， 笹川和彦, 藤﨑和弘
9.
ロボ、正確に自動採血，日経産業新聞，10月10日(2018), 7
Ⅳ．招待講演・講義
1.
Theoretical Analysis of a Crack Problem in Electrothermal Field,
The 1995 ASME International Mechanical Engineering Congress and Exposition,
Symposium on Application of Fracture Mechanics in Electronic Packaging and
Materials, Nov. 12-17, 1995, San Francisco, USA
2.
折れ曲がる金属薄膜配線におけるエレクトロマイグレーション，日本機械学会RC-144エレクトロニック・パッケージングにおけるマイクロ接合の信頼性評価に関する研究分科会，1997年9月19日（グランドヒル市ヶ谷）東京
3.
折れ曲がる金属薄膜配線におけるエレクトロマイグレーション，日本機械学会P-SC275電子デバイスの材料力学的問題に関する調査研究分科会，1997年9月25日（東工大精研）
4.
電子パッケージ金属薄膜配線におけるエレクトロマイグレーション損傷支配パラメータの特定と損傷予測，日本機械学会材料力学部門実験力学先端技術研究会，1998年9月30日（宮城県工技センター）
5.
電子デバイス用配線の強度評価、電子パッケージの熱的劣化に関する力学的・物性的総合研究－九州大学応用力学研究所研究集会, 九州大学（福岡春日市）(1999-12-7,8)
6.
ＬＳＩ配線における断線予測シミュレーション、日本金属学会「微細材料の力学特性と信頼性」シンポジウム,東京大学（東京）, (2000-1-13)
7.
Electromigration Damage in Bamboo Line, International Conference
of Role of Mechanics for Development of Science and Technology, Mesomechanics
2000, June 13-16, 2000, 6/16 Xi’an,
China
8.
"Prediction of Metal Line Failure by Using a Governing
Parameter of Electromigration Damage", Chonbuk National
University/Nationally Accredited High-Tech Engineering Center, Chonju, Korea,
Director/Prof. Sung-Mo Yang, 200/8/28
9.
"Prediction of Metal Line Failure by Using a Governing
Parameter of Electromigration Damage” Kyungpook National University, Taegu,
Korea, Prof. Seock-Sam Kim, 2000/8/29
10.
金属薄膜配線のエレクトロマイグレーション，エレクトロマイグレーションによるボイド・ヒロック形成の観察，公開講座「材料物理工学セミナー」―機械材料の高性能・多機能化のための材料界面の設計と制御―，東北大学工学部，2000，9, 27
11.
金属薄膜配線のエレクトロマイグレーション，エレクトロマイグレーションによるボイド・ヒロック形成の観察，東北大学大学院工学研究科機械・知能系学際基盤科目「材料物理工学特論」，東北大学工学部，2000，9, 27
12.
電子デバイス信頼性確保のための微細配線断線故障の実用的予測・防止法の開発，青森県産学連携推進会議，弘前大学，2001-11-20
13.
保護膜で被覆された多結晶配線のエレクトロマイグレーション損傷支配パラメータとそれを用いた断線予測法，第4回ASET（技術研究組合超先端電子技術開発機構）配線技術研究会 －シミュレーションと物性－，ＡＳＥＴ本部（東京），2002年2月28日
14.
金属薄膜配線の信頼性試験・評価（４．１配線損傷と寿命予測，４．２数値シミュレーションによる高精度信頼性評価Ⅰ，４．３数値シミュレーションによる高精度信頼性評価Ⅱ,３回分），東北大学大学院工学研究科，ＩＳＴＵ，電子パッケージコース パッケージ性能試験・評価，2002,10
15.
医療・福祉の生体力学的研究の２，３例，あおもり健康福祉機器開発協議会フォーラム「健康・医療・福祉産業への取り組み」，弘前商工会議所，2002-9-3
16.
半導体集積回路配線の断線故障予測，日本材料学会破壊力学部門委員会，仙台市戦災復興記念館（仙台），２００２－１１－１５
17.
電子デバイス信頼性確保のための微細配線の断線故障予測法の開発，秋田県内の工学系研究機関による研究紹介 東北地方の高専・大学の研究紹介と交流会 （秋田編），秋田大学ベンチャー・ビジネス・ラボラトリー（秋田市），2003年11月7日
18.
デバイス配線のエレクトロマイクレーション損傷と高精度信頼性評価，日本テクノセンター・セミナー，日本テクノセンター（東京），２００４－１１－４
19.
集積回路の配線損傷メカニズムとエレクトロマイグレーション，（株）ルネサス北日本セミコンダクタ 津軽工場（五所川原市），2005年5月27日
20.
科研費申請書の作成 理工学部笹川和彦の場合，平成１７年度弘前大学科学研究費補助金説明会，弘前大（弘前市），平成１７（２００５）年１０月６日
21.
薄膜配線のエレクトロ・マイグレーション損傷 ―半導体集積回路における配線損傷メカニズムと信頼性評価を中心に―，新光電気工業株式会社（長野市），2005/11/25
22.
微細電子デバイス配線の電流による疲労損傷と信頼性評価法，日本材料学会東北支部特別講演会・総会，東北大学青葉記念会館（仙台），２００６－３－１１
23.
エレクトロマイグレーション損傷と数値シミュレーションによる信頼性評価法，日本材料学会Ｘ線材料強度部門委員会第４３回Ｘ線材料強度に関する討論会，東京都大田区産業プラザ（東京），２００６－１２－１
24.
電子デバイス配線のエレクトロマイグレーション損傷と高精度信頼性評価，TH企画セミナーセンター・セミナー，総評会館（東京），２００７－５－１６
25.
生体の接触圧力測定システムの開発と応用 ーリハビリテーション領域への応用を中心にー，第６０回藤田保健衛生大学リハビリテーション部門研修会（藤田リハビリテーション医学・運動学研究会），藤田保健衛生大学衛生学部（愛知県豊明市），２００７－７－２３
26.
金属薄膜配線におけるエレクトロマイグレーション損傷のしきい電流密度評価，日本材料学会第124回破壊力学部門委員会，ハーネル仙台（仙台），２００７－８－６
27.
生体に作用する接触圧力の測定システムの開発と応用，次世代センサ協議会東北支部講演会「MEMSセンサの開発動向と応用 」2007/11/14 弘前大学
28.
医用および微小材料システムの評価法の開発研究，若手研究者＆院生のためのキャリアアップ講演会，2007/12/26，新潟大学VBL（新潟）
29.
科研費申請書の作成，八戸高専科研費申請書作成講習会，八戸高専（八戸），２００９－１０－１３
30.
「電子デバイスと生体の材料システムを評価する」，平成22年度化学系学協会東北大会，2010/9/26，岩手大学（盛岡）
31.
「生体の接触圧力分布の測定」，日本生体医工学会第2回次世代内視鏡技術研究会，平成22年11月13日，弘前大学（弘前）
32.
「生体内の荷重伝達解明に基づく力学的な病因特定と治療・診断法の開発」，第６７回グローバルCOE「ナノ医工学シリーズセミナー」（2007年度採択グローバルＣＯＥプログラム 新世紀世界の成長焦点に築くナノ医工学拠点），2012/1/26，東北大学医工学研究科（仙台）
33.
「材料システムとしての電子機器安全性と生体機能性の評価」2013/3/25平成２４年度日本材料学会東北支部総会・材料フォーラム講演会，特別講演，カレッジプラザ（秋田市）
34.
「微細電子配線の安全性評価と生体の応力評価」，2013/4/26日本非破壊検査協会 東北支部「支部会・講演会」 特別講演，青年文化センター（仙台市）
35.
「バーチャルリアリティ実現のための皮膚接着型触覚センサ」JST新技術説明会，2014/3/13科学技術振興機構東京別館ホール（東京）
36.
「高密度電流の流れる金属配線の許容電流予測と信頼性向上」JST新技術説明会，2015/3/10科学技術振興機構東京別館ホール（東京）
37.
Study on Damage of Carbon Nanotubes under Electronic Current,
7th Annual World Congress of Nano Science & Technology – 2017, Invited
Speech, Fukuoka, 24 Oct., 2017, Kazuhiko Sasagawa, (Kazuhiro Fujisaki)
Ⅴ．参考論文(アブストラクト査読国際会議プロシーディングほか)
1.
The Load-Bearing Functional Evaluation of PTB Orthosis, Proceedings
Third U.S.A.-China-Japan Conference On Biomechanics, (1991), 74-75, T. Hara, K.
Sasagawa, Y. Koga, H. Takahashi
2.
CONTACT PRESSURE DISTRIBUTION ON THE PATELLO-FEMORAL JOINT BEFORE
AND AFTER TOTAL KNEE ARTHROPLASTY, TRANSACTIONS of the 38th Annual Meeting
Orthopaedic Research Society, 17 (1992), 332, G. Ohmori, K. Sasagawa, J.E.
Bechtold, P.T. Bianco, R.B. Gustilo, T. Hara, H. Takahashi, Y. Koga
3.
Radial Styloid Wedge Osteotomy for Early SLAC Wrist, Nonunion of
the Scaphoid and for Painful Radial Styloid Impingement Syndrome: A Preliminary
Report Wrist Disorders, Springer-Verlag,
4.
Numerical Simulation of Electromigration in Angled Metal Line,
Proceedings of the International Symposium on Microsystems, Intelligent
Materials and Robots, (1995), 213-216, Kazuhiko Sasagawa, Takanori Yamauchi,
Masumi Saka and Hiroyuki Abé
5.
Verification of a Governing Parameter for Electromigration
Damage in Metal Lines, Proceedings of 1999 IEMT/IMC Symposium, (1999), 304-309,
K. Sasagawa N. Nakamura M. Saka H. Abé
6.
Electromigration Damage in Bamboo Line [Proc. of an Int.
Conf. of Mechanics for Development of Science and Technology, June 2000,
7.
Prediction of Bamboo Line Failure by Using a Governing Parameter
of Electromigration Damage [Proc. of Int. Workshop on Sensing and Evaluation of
Materials System, Sendai, Japan, 22 Aug., 2000, Eds. M. Saka, H. Soyama,
(2000-8), 25-32] K. Sasagawa, K. Naito, M. Hasegawa, M. Saka and H. Abé
8.
A Governing Parameter for Electromigration Damage and Prediction
of Failure in Al Lines [Proc. of Int. Symposia on Material Science for the 21st
Century, Osaka, Japan, 21-26 May., 2001, (2001-5-21), 245-248] K. Sasagawa, K.
Naito, M. Hasegawa, M. Saka and H. Abé
9.
A Governing Parameter for Electromigration Damage in Passivated
Polycrystalline Lines and Its Verification [Proc. Sixth International Workshop
on Stress-Induced Phenomena in Metallization, AIP, Cornell Univ., Ithaka, USA,
July 25-27, 2001, (2001-7)] K. Sasagawa, M. Hasegawa, M. Saka and H. Abé
10. Prediction
Method of Electromigration Failure in Passivated Polycrystalline Line [Proc.
International Symposium of Precision Engineering and MEMS’ 2002, Nov. 3-6, 2002, Hangzhou, China, 14 - 20] K.
Sasagawa, M. Hasegawa, M. Saka and H. Abé
11. Evaluation
Method of the Threshold Current Density for Electromigration Damage in IC Metal
Lines [The Second Japan-Taiwan Workshop on Mechanical and Aerospace
Engineering, Tokyo Institute of
12. Derivation of
the Film Characteristic Constants Using the Governing Parameter for
Electromigration Damage at Metal Line Ends, Proc. of ISMME2003, The
International Symposium on Micro-Mechanical Engineering―Heat Transfer, Fluid
Dynamics, Reliability and Mechatronics―, JSME, Tsuchiura, Japan, December 1-3,
2003, (2003-12-1), 433 – 439, M. Hasegawa, K. Sasagawa, S. Uno and M. Saka
13. Derivation of
Film Characteristic Constants of Polycrystalline Line for Reliability
Evaluation against Electromigration Failure [2004 ASME International Mechanical
Engineering Congress & Exposition, ASME, Nov. 13-19, 2004, Anaheim, USA,
paper ID IMECE2002-60620 (presentation only)] M. Hasegawa, K. Sasagawa, S. Uno,
M. Saka and H. Abé
14. Dynamic
Measurement of Pressure Distribution of Bi-ski Seat Interface [Journal of
Biomechanics Vol. 39/S1(2006), Abstracts of the 5th World Congress of
Biomechanics, Munich, Germany(2006-7/29-8/4),S553] H. Yajima and
K. Sasagawa
15. Development of
Measurement System of Contact Pressure Distribution in Human Small Joint
[Journal of Biomechanics Vol. 39/S1(2006), Abstracts of the 5th World Congress
of Biomechanics,
16. Change of
Contact Pressure Distribution in Patellofemoral Joint with High Tibial Osteotomy
[Transactions of the 53th Annual Meeting of Orthopaedic Research Society
(CD-ROM),
17. Evaluation of
Threshold Current Density of Electromigration Damage in Interconnect Tree with
Angled Cu Lines [12th International Conference on Electronics Materials and
Packaging(CD-ROM), Singapore, Republic of Singapore, (2010-10/25~27), Papar ID:
110-116] K. Sasagawa, T. Abo
18. Change in
Damage Mechanism of MWCNTs under Electric Current with Oxygen Concentration
[13th International Conference on Electric Materials and Packaging(USB frash
drive), Kyoto, Kyoto Garden Palace, Japan, (2011-12/12~15), 69-72] K. Sasagawa
and J. Unuma
19. Development of
Numerical Simulation of Electromigration Damage in Cu Multilevel
Interconnection with Reservoir Structure [Abstracts of the 12th International
Workshop on Stress-Induced Phenomena in Microelectronics, Kyoto/Co-op Inn
Kyoto, Japan, (2012-5/28-30), 31-32] K. Sasagawa and T. Yanagi
20. Evaluation of
Threshold Current Density in Interconnect with Reservoir Structure Using
Numerical Modeling of Electromigration Damage [Extended Abstracts of the 2012
International Conference on Solid State Devices and Materials, Kyoto/Kyoto
International Conference Center, Japan, (2012-9/25-27), 56-57] K. Sasagawa and
T. Yanagi
21. Development of
Shear Stress Sensing System for Application to a Haptic Display [Proceedings of
the 7th International Symposium on Advanced Science and Technology in
Experimental Mechanics, Taipei/The Grand Hotel, Taiwan, (2012-11/8-11), Paper
ID: M117] K. Sasagawa, T. Oyama, K. Tokiyoshi and K. Yokoyama
22. Experimental
Study of Damage Mechanism of Carbon
Nanotube as Nano-component of Electronic Devices under High Current Density
[Proceedings of the ASME 2013 International Technical Conference and Exhibition
on Packaging and Integration of Electronic and Photonic Microsystems (CD-ROM),
Paper ID:IPACK2013-73130, 5 pages, (2013/7/18, Hyatt Regency San Francisco
Airport, San Francisco, USA)] K. Sasagawa, K. Fujisaki, J. Unuma, R. Azuma
23. Measurement
System of Contact Pressure Distribution between Soft Tissues of the Oral Cavity
and Pharynx [Proceedings of APCB2013, 2013.8.29-31, Seoul/Korea] K. Sasagawa,
S. Tsukahara, Y. Osato, K. Fujisaki
24. Development of
Tactile Sensing System for Haptic Interface [Proceedings of Int. Symp. on
IREMD, pp. 73-75, 2013.9.12-13, Hirosaki/Japan] T. Oyama, K. Sasagawa, K.
Fujisaki
25. Measurement
System of Contact Pressure Distribution in Oral Cavity during Swallowing and
Articulation [Proceedings of Int. Symp. on IREMD, pp. 107-110, 2013.9.12-13,
Hirosaki/Japan] T. Satoshi, K. Sasagawa, R. Ishikawa, K. Fujisaki
26. Integration of
Flexible and Thin Sensor System of Contact Pressure and Shear-stress for
Application to Haptic Display [The 7th World Congress of Biomechanics, Boston,
USA, 20140706~11 Poster] Shunsuke Sato, Takuma Oyama, Kazuhiro Fujisaki,
Kazuhiko Sasagawa
27. Effect of
Demineralization on Impact Fracture Characteristics of Bovine Cortical Bone
Tissue [The 7th World Congress of Biomechanics, Boston, USA, 20140706~11
Poster] Kazuhiro Fujisaki, Hiroya Yokoyama, Ayumi Hasegawa, Kazuhiko Sasagawa
28. Damage
Observation of CNT Networked Structure under High Current Density
[InterPACKICNMM2015 (ASME)，San Francisco,
USA ，20150706-9 20150706]
K. Fujisaki, K. Sasagawa, D. Narita
29. Evaluation of
Allowable Current Density for Electromigration Damage in Via-connected
Interconnect [17th Electronic Materials and Packaging Conference, (EMAP2015)，4pages ，Portland, USA，20150901-4 20150902] K.
Fujisaki, K. Sasagawa, H. Narita
30. Measurements of
Contact Pressure and Shear Stress on the Sole of Foot by Using Thin and
Flexible Sensor [The 8th Asian-Pacific Conference on Biomechanics，p. 320，20150916-19 20150918，Sapporo]
Satoshi Ogawa, Noritugu Kikuhara, Kazuhiro Fujisaki, Kazuhiko Sasagawa
31. Prediction of
Deformation Damages of Tree Branches Based on Bending Analysis and Bioelectric
Response Measurements [The 8th Asian-Pacific Conference on Biomechanics，p. 357，20150916-19
20150918，Sapporo] Kuniaki Sato,
Yukihiro Yamada, Kazuhiro Fujisaki, Kazuhiko Sasagawa
32. Improvement of
Impact Toughness of Cortical Bone by Means of Local Demineralization of Defect
Area on Structure [The 8th Asian-Pacific Conference on Biomechanics，p. 303，20150916-19
20150918，Sapporo] Ayumi Hasegawa,
Kazuhiro Fujisaki, Kazuhiko Sasagawa
33. Damage of CNT
Network Structure under Accelerated Condition [Abstract book ATEM'15，p. 211, International Conference on Advanced Technology in
Experimental Mechanics 2015 (ATEM’15) and The 14th Asian Conference on Experimental
Mechanics (ACEM14) ，Toyohashi, Japan，20151004-8 20151005] Shunsuke Sato, Kazuhiro Fujisaki, Kazuhiko
Sasagawa, Takuya Katabira
2018年11月9日現在